资料
价格 供货 现货 |
ICminer>Package Catalog: |
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CERQUAD Ceramic Quad Flat Pack 详细规格 |
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DIP Dual Inline Package 详细规格 |
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DIP-tab Dual Inline Package with Metal Heatsink |
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Flat Pack |
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LAMINATE CSP 112L Chip Scale Package 详细规格 |
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LAMINATE CSP 128La Chip Scale Package 详细规格 |
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LAMINATE CSP 128Lb Chip Scale Package 详细规格 |
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LAMINATE CSP 16L Chip Scale Package 详细规格 |
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LAMINATE CSP 176L Chip Scale Package 详细规格 |
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LAMINATE CSP 20L Chip Scale Package 详细规格 |
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LAMINATE CSP 24L Chip Scale Package 详细规格 |
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LAMINATE CSP 28L Chip Scale Package 详细规格 |
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LAMINATE CSP 32L Chip Scale Package 详细规格 |
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LAMINATE CSP 40La Chip Scale Package 详细规格 |
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LAMINATE CSP 40Lb Chip Scale Package 详细规格 |
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LAMINATE CSP 48La Chip Scale Package 详细规格 |
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LAMINATE CSP 48Lb Chip Scale Package 详细规格 |
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LAMINATE CSP 48Lc Chip Scale Package 详细规格 |
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LAMINATE CSP 80L Chip Scale Package 详细规格 |
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LAMINATE CSP 96L Chip Scale Package 详细规格 |
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LAMINATE TCSP 20L Chip Scale Package 详细规格 |
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LAMINATE TCSP 24L Chip Scale Package 详细规格 |
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LAMINATE TCSP 32L Chip Scale Package 详细规格 |
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LAMINATE UCSP 20L Chip Scale Package 详细规格 |
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LAMINATE UCSP 24L Chip Scale Package 详细规格 |
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LAMINATE UCSP 32L Chip Scale Package 详细规格 |
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QFP Quad Flat Package |
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QFP Quad Flat Package |
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SIP Single Inline Package |
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SO Small Outline Package |
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TO215-A[JEDEC] | TO215-A[JEDEC] Registration - Coaxial package Outline. Item 269G. 详细规格 |
TO236-H[JEDEC] | TO236-H[JEDEC] Registration - Revision to 3 lead SOT Package, Header Family. Item 11.10-379 详细规格 |
TO264-B[JEDEC] | TO264-B[JEDEC] Registration - Flange-Mounted Header Family, 3 Lead, Peripheral Leaded Package. Item 11.10-. 详细规格 |
TO265-A[JEDEC] | TO265-A[JEDEC] Registration - 3 Lead Flange-Mounted Ceramic Power Package.R-CSFM-T3. Item 11.10-309. 详细规格 |
TO269-A[JEDEC] | TO269-A[JEDEC] Registration - 4 Lead Small Outline Package (SOP). Item 11.10-358 详细规格 |
TO270-A[JEDEC] | TO270-A[JEDEC] Registration - Two Lead Surface Mount Power Package. Item 11.10-386. 详细规格 |
TO271-A[JEDEC] | TO271-A[JEDEC] Registration - 4 Lead Quad Flat Pack (QFP). 详细规格 |
TO272-A[JEDEC] | TO272-A[JEDEC] Registration - 6 Lead Surface Mount Power Package. Item 11.10-387 详细规格 |
TO273-A[JEDEC] | TO273-A[JEDEC] Registration - 1R Modification of 3 Lead TO-220, Plastic Flange Mounted Package. Item 11.10-389. 详细规格 |
TO274-A[JEDEC] | TO274-A[JEDEC] Registration - 3 Lead Plastic Flange-Mounted Package. Item 11.10-401 详细规格 |
TO275-A[JEDEC] | TO275-A[JEDEC] Registration - Plastic Flange Mounted, 2 Lead, Power Package. Item 11.10-405. 详细规格 |
TSOP Thin Small Outline Package |
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TSSOP or TSOP II Thin Shrink Outline Package |
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ZIP Zig-Zag Inline Package |
msn@icminer.com QQ:525463 |